Six Core Capabilities Covering the Full Yield Management Chain
From macro overview to micro root cause, from passive response to proactive alerting — building a complete closed loop for semiconductor assembly & test yield management.
Overall Yield Overview
Automatically aggregates yield trends by product Phase, package type, and time dimension. Top 5 defect Pareto presented in one click, quickly identifying the most impactful defect types.
Single Defect Analysis
Automatically calculates single defect PPM, supports multi-date comparison and process station detail drill-down — from defect code straight to equipment, lot, and station-level data.
Commonality Analysis
Visually traces defect distributions across material, equipment, site, and personnel dimensions via Sankey diagrams, quickly focusing on abnormal factors and narrowing the root cause scope.
FARCCA Auto Report
Automatically fills in data and basic information based on system analysis results, generates the FARCCA report and routes it for approval — replacing 8 hours of manual filing.
Metrics Alarm
Automatically triggers alerts when yield/defect metrics exceed thresholds, combined with WeChat Work/email push notifications — shifting from "post-event review" to "in-process intervention."
AI Root Cause Recommendation
Builds a RAG knowledge base from historical issues, root causes, and countermeasures, combined with LLM for root cause intent recognition and intelligent solution recommendation.
